With our – xPU Connecticity platform – partners can envision a future of eco-friendly data centers with more efficient cooling and significantly reduced space requirements.
With the HyCom xPU Connectivity Platform, our partners can take advantage of:
integrated high-performance electro-optic waveguide modulators
enabling multi-wavelength modulation in an ultra-compact form factor
consuming 30x less energy
transferring data 10x faster and beyond
These improvements are made possible by multiple wavelengths, advanced materials, and our proprietary design.
The result: a greener, more cost-effective, and compact solution for AI data centers.
